Skin Effect & Frequency-Dependent

Frequency-dependent checks show how conductor behavior changes with microwave

frequency, penetration depth, and kinetic inductance.

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Parameter

Symbol / Unit

Extraction Method

Typical Q3D Value

Ideal / Optimal

Good Range

Worst Case

Why It Matters

Key Design Note

45

Skin Depth at 5 GHz

delta_s / μm

delta_s = √(2ρ/ωμ); Q3D skin-effect mode at frequency

0.9 μm (Al at RT)

0.5 – 2 μm

0.5 – 3 μm

> 5 μm (film < δ_s)

If metal thickness < δ_s entire cross-section carries current and R_ac ≈

R_dc (good for thin films)

Al at 4K is superconducting so delta_s concept replaced by London

penetration depth λ_L: bulk Al ~16–55 nm; thin-film Al (50–200 nm film) typically 60–163 nm — increases as film thickness decreases

46

AC/DC Resistance Ratio

R_ac/R_dc

Q3D frequency sweep; skin-effect solver comparison at DC vs 5 GHz

1.0 – 1.05 (thin film)

≈ 1.0 (thin film < δ_s)

1.0 – 2.0

> 5

Thin-film qubits (t ~ 100–200 nm) operate below skin-depth limit so R_ac ≈

R_dc

Normal-metal (Cu, Au) transmission lines show R_ac/R_dc ~ 3–5 at 5 GHz; use

SC lines at mK

47

Propagation Constant (gamma)

α / dB/m, β / rad/m

Q3D RLGC → gamma = √((R+jωL)(G+jωC))

α < 0.1 dB/m (SC CPW)

α < 0.1 dB/m; β = ω√(L’C’)

α 0.1 – 1 dB/m

α > 10 dB/m

α sets transmission line attenuation; β sets phase velocity; both from RLGC

per unit length

For long interconnects (> 10 mm) even 0.1 dB/m causes measurable signal

loss; use SC Al/Nb

48

Phase Velocity (v_ph)

v_ph / ×10⁸ m/s

Q3D RLGC → v_ph = ω/β = 1/√(L'C’)

1.2 – 1.4 ×10⁸ m/s

1.2 – 1.4 ×10⁸ m/s (CPW on Si)

1.0 – 1.6 ×10⁸ m/s

< 0.8 or > 2.0

Sets resonator physical length for target frequency; L = v_ph/(4f_r) for λ/4

resonator

v_ph = c/√varepsilon_eff; on Si varepsilon_eff ≈ 6.3 → v_ph ≈ 1.19×10⁸ m/s;

λ/4 at 7 GHz ≈ 4.25 mm

49

Per-Unit-Length Resistance (R’)

R’ / mΩ/mm

Q3D frequency-dependent R matrix; RLGC R’ vs frequency

< 0.1 mΩ/mm (SC Al)

< 0.1 mΩ/mm

0.1 – 2 mΩ/mm

> 10 mΩ/mm

Distributed series resistance determines attenuation α ≈ R’/(2Z₀); critical

for long interconnects

At 4K Al becomes superconducting: R’ → 0 below T_c; use R’ to identify

non-SC regions

50

Per-Unit-Length Inductance (L’)

L’ / nH/mm

Q3D RLGC magnetostatic solve

0.3 – 0.5 nH/mm

0.3 – 0.5 nH/mm (50 Ω CPW on Si)

0.2 – 0.8 nH/mm

< 0.1 or > 2 nH/mm

Distributed inductance per mm; with C’ sets Z_0 = √(L’/C’) and v_ph =

1/√(L'C’)

L’ includes both geometric and kinetic contributions; L'_kinetic small for

Al (~0.01–0.05 nH/mm)

51

Per-Unit-Length Capacitance (C’)

C’ / pF/mm

Q3D RLGC electrostatic solve

0.1 – 0.2 pF/mm

0.1 – 0.2 pF/mm (50 Ω CPW on Si)

0.05 – 0.3 pF/mm

< 0.02 or > 0.5 pF/mm

Distributed capacitance per mm; with L’ sets Z_0 and varepsilon_eff; narrow

gap increases C’ (lowers Z_0)

Check: Z_0 = √(L’/C’) ≈ 50 Ω; v_ph = 1/√(L’×C’) ≈ 1.2×10⁸ m/s; these are

consistency checks